典型案例二
发布日期：2017-04-17 15:11:48 访问次数：17839
▶ TSMC 40GP 1P10M
▶ Flip-Chip LFBGA SiP 1Gb DDR3 KGD
▶ Max Clock Freq: 515MHz
▶ SerDes IP: 10Gbps
▶ DDR3 IP: 800Mbps
▶ RGMII I/O
▶ Voltage: 0.9V/1.8V device
▶ Die size: 2.58x3.44mm^2
▶ Direct production success
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