Packaging & Assembly Services

With in-house package development and substrate design capabilities and strong supports from world-class assembly houses, Qualchip provides the most cost-effective SoC package solutions ranging from tiny QFN to complicated Flip-Chip BGA for customer products. In the past years, we’ve successfully developed and delivered 64/208LQFP,
LFBGA and 10-layer Flip-Chip BGA packages to customers on time.
 
Qualchip experienced package engineers are familiar with both existing package product lines and future road maps of 1st-tier assembly houses like Amkor and ASE. In
associate with our expertise on substrate and SMT (Surface Mount Technology) processes, we can therefore work out the overall optimal package solutions for customer
on-going and next generation projects. In terms of chip performance/price ratio, we believe our alliance with world-class assembly houses will ensure customers the most
benefits.
 
Our Advantages
1) A variety of package types offered by world-class assembly houses
    that satisfy almost all application requirements
    Small form-factor packages: WLCSP, QFN, LQFP/TQFP, TFBGA/LFBGA...
    High pin/ball count package: QFP, PBGA/HSBGA, Flip-Chip BGA …
    System-in-Package package: Stacked-die/3D package, Package-in-Package, 
                                                   Package-on-Package…
2) In-house substrate rough design (feasibility study) and routing 
    capabilities to greatly diminish design cycle time and  
    communication efforts
3) Extra-fast engineering sample solution to shorten samples’ 
    processing time to 2~3 days
4) EDA vendors’ professional supports to help customers build the
    system-level model
5) Assembly partners’ commitments of competitive process turn-around
    time and sufficient production capacity